Method for manufacturing a self - aligned split-gate flash memory cell

ABSTRACT

A method for manufacturing a split-gate flash memory cell, comprising the steps of forming an active region on a semiconductor substrate; forming a buffer layer on the semiconductor substrate; forming a first dielectric layer on the buffer layer; removing part of the first dielectric layer; defining an opening; removing the buffer layer within the opening; forming a gate insulating layer and floating gates; forming a source region in the semiconductor substrate; depositing a conformal second dielectric layer on the opening; removing the buffer layer outside the first dielectric layer and the floating gates; and forming an oxide layer and control gates.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates in general to a method for manufacturing flash memory integrated circuits, and more particularly to a method for manufacturing a self-aligned split-gate flash memory cell.

[0003] 2. Description of the Prior Art

[0004] Conventional Erasable and Programmable Read-Only Memory (EPROM) devices have memory cells which comprise floating-gate transistors. A wide variety of EPROM is available. One form of EPROM is a flash EPROM.

[0005] Conventional flash memory devices have a split-gate structure comprised of one floating gate and one control gate. To form the floating and control gates, flash memory cells, however, are often bulky and have complex geometries of multiple gate layers. Therefore, it is difficult to fabricate a split-gate structure in a desired memory cell space.

[0006] Referring to FIG. 1, the conventional split-gate flash memory cell has a structure wherein the source/drain regions 11 and 12 are formed in a semiconductor substrate 10, a gate insulating film 13 is formed on the substrate 10, a floating gate 14 is formed on the gate insulating film 13, and a control gate 16 is formed on the floating gate 14. The control gate 16 and the floating gate 14 are insulated from each other by a dielectric film 15, and the split gate of the flash memory cell is thus made.

[0007] The floating gate 14 is defined by the photolithographic process known to one of ordinary skill in the art. Unfortunately, it is often difficult to self-align and requires a larger size of memory cell. In addition, the channel length of the control gate 16 is determined during the process of forming the floating gate 14. In this connection, in the case where a misalignment of a mask occurs during the photolithographic process forming the floating gate 14, a desired channel length of the control gate 16 cannot be readily obtained.

[0008]FIGS. 2A to 2E illustrate the manufacturing sequences of a conventional split-gate flash memory device.

[0009] Referring to FIG. 2A, an insulating film 21 is formed on a semiconductor substrate 20 and is photo-etched to form openings 22. Using the insulating film 21 as an ion-implantation blocking mask, n⁺-type impurity ions are implanted into the semiconductor substrate 20, thereby forming source/drain regions 23 and 24.

[0010] As shown in FIG. 2B, after removing the insulating film 21, which serves as an ion-implantation blocking mask, a gate insulating film 25 is formed on the substrate 20. Then, a polysilicon film 26 is formed on the gate insulating film 25.

[0011] As shown in FIG. 2C, after coating the polysilicon film 26 with a photoresist film 27, a photomask is aligned on the photoresist film 27, and the polysilicon film 26 is photo-etched. As shown in FIG. 2D, floating gates 26′ are thus formed.

[0012] As shown in FIG. 2E, a dielectric film 28 is formed on the surfaces of the floating gates 26′, and a control gate 29 is formed over the entire surface of the substrate 20, thereby obtaining the control split-gate flash memory device.

[0013] However, in a case where a photomask is misaligned, the channel length of the floating gates 26′ is relatively increased or decreased. Therefore, the channel length of the split control gates 29 is decreased or increased.

SUMMARY OF THE INVENTION

[0014] It is therefore an object of the invention to provide a fixed space between the floating gates of the flash memory cell.

[0015] It is another object of the invention to provide the flash memory cell with a self-aligned split gate to reduce the size of the memory cell.

[0016] To achieve these objects and advantages, and in accordance with the purpose of the invention, as embodied and broadly described herein, the invention is directed towards a method for manufacturing a split-gate flash memory cell, comprising the steps of forming an active region on a semiconductor substrate; forming a buffer layer on the semiconductor substrate; forming a first dielectric layer on the buffer layer; removing part of the first dielectric layer; defining an opening; removing the buffer layer within the opening; forming a gate insulating layer and floating gates; forming a source region in the semiconductor substrate; depositing a conformal second dielectric layer on the opening; removing the buffer layer outside the first dielectric layer and the floating gates; and forming an oxide layer and control gates.

BRIEF DESCRIPTION OF THE DRAWINGS

[0017] These and other features and advantages of the present invention will be better understood by considering the following detailed description of the invention which is presented with the attached drawings.

[0018]FIG. 1 is a cross-sectional view of a conventional split-gate flash memory cell;

[0019] FIG.2, including FIG. 2A, 2B, 2C, 2D, and 2E, shows cross-sectional views depicting the steps of manufacturing a flash memory device having a conventional split gate structure;

[0020]FIG. 3, including FIG. 3A, 3B, 3C, 3D, 3E, 3F, and 3G, shows cross-sectional views depicting the steps of a manufacturing a split-gate flash memory cell, according to one embodiment of the present invention; and

[0021]FIG. 4, including FIG. 4A and 4B, shows cross-section views depicting part of the steps of manufacturing a split-gate flash memory cell, according to another embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Referring now to FIG. 3A, an active area 31 is formed on a p-type semiconductor substrate 30 by any known device isolation process such as local oxidation of silicon (LOCOS) or shallow trench isolation (STI). A buffer oxide layer 32 having a thickness of about 200 angstroms is formed on the semiconductor substrate 30 by conventional chemical vapor deposition (CVD) process.

[0023] Referring to FIG. 3B, a dielectric layer 33 is deposited on the buffer oxide layer 32. The dielectric layer 33 includes silicon nitride having a thickness of, for example, 2,000 angstroms. A known photolithographic process is performed to remove part of silicon nitride layer 33 and form an opening 34.

[0024] Referring to FIG. 3C, the buffer oxide layer 32 within the opening 34 is removed. A thin oxide layer of a thickness of about 80 angstroms is thermally grown on the substrate 30 to form a gate insulation layer 35. Then, polysilicon or amorphous silicon 36 of an appropriate thickness is deposited on the silicon nitride layer 33 and the oxide layer 35, and being doped with a suitable impurity to further serve as floating gates.

[0025] Referring to FIG. 3D, part of the silicon layer 36 is dry etched anisotropically. The etching is stopped on the oxide layer 35 which is subsequently removed by wet etch. Sidewall spacer floating gates 36′ are thus formed between the silicon nitride layer 33 and the semiconductor substrate 30. A source region 37 is formed in the substrate 30 by ion implantation.

[0026] Referring to FIG. 3E, an oxide layer 38 is formed on the sidewall spacer floating gates 36′ and the substrate 30, and excess oxide layer is then selectively removed by chemical mechanical polishing (CMP) method.

[0027] Referring to FIG. 3F, the silicon nitride layer 33 is removed by wet etch. Subsequently, the buffer oxide layer 32 outside the floating gates 36′ is removed. After thermal oxidation at a temperature of 800 DEG C., an oxide layer 39 having a thickness from 150 angstroms to 250 angstroms is formed by CVD. A polysilicon layer 40 formed over the entire surface of the substrate 30 is isotropically etched to remove part of the polysilicon layer 40. The remaining polysilicon layer 40 is doped with a suitable impurity to serve as control gates 40′, as shown in FIG. 3G.

[0028] According to another embodiment of the present invention, after forming the sidewall spacer floating gates 36′, a dielectric layer 41 is formed, as shown in FIG. 4A. The dielectric layer can be an oxide, a combination of oxide and silicon nitride (ON), or a combination of oxide, silicon nitride and oxide (ONO), the type of dielectric used depends upon the application. An isolation layer 41′ is formed along the opposite sidewalls of the sidewall spacer floating gates 36′ by etch. A doped polysilicon layer 42 is formed and etched back. As shown in FIG. 4B, an oxide layer 43 is formed, and the excess oxide layer is selectively removed by CMP. In subsequence, the control gates 40′ will be formed in accordance with the process steps as shown in FIG. 3F through FIG. 3G.

[0029] Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspect is not limited to the specific details, and illustrated example shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. 

What is claimed is:
 1. A method for manufacturing a self-aligned split-gate flash memory cell, comprising: providing a semiconductor substrate having an active region; forming a buffer isolation layer; forming a first dielectric layer on said buffer isolation layer; removing part of said first dielectric layer to define an opening; removing said buffer isolation layer within said opening; forming a gate isolation layer on the semiconductor substrate within said opening; forming a silicon layer; implanting ions into said silicon layer to be conductive; removing part of said silicon layer and gate isolation layer, respectively, to form floating gates; forming a source region in said semiconductor substrate; forming a conformal second dielectric layer within said opening; removing the first dielectric layer and the buffer isolation layer outside said floating gates; forming, in order, a third dielectric layer and a control gate layer; and removing part of the control gate layer to form control gates.
 2. The process of claim 1, wherein the thickness of said buffer isolation layer is about 50 angstroms to 500 angstroms.
 3. The process of claim 1, wherein the thickness of said first 2 dielectric layer is about 500 angstroms to 5,000 angstroms.
 4. The process of claim 1, wherein said part of silicon layer is removed by anisotropic etch.
 5. The process of claim 1, wherein said part of gate isolation layer is removed by wet etch.
 6. The process of claim 1, wherein said floating gates are of opposite-sidewall, spacer-like structure.
 7. The process of claim 1, wherein said third dielectric layer is an oxide.
 8. A method for manufacturing a self-aligned split-gate flash memory cell, comprising: providing a semiconductor substrate having an active region; forming a buffer isolation layer; forming a first dielectric layer on said buffer isolation layer; removing part of said first dielectric layer to define an opening; removing said buffer isolation layer within said opening; forming a gate isolation layer on the semiconductor substrate within said opening; forming a silicon layer; implanting ions into said silicon layer to be conductive; removing part of said silicon layer and gate isolation layer, respectively, to form floating gates; forming a source region in said semiconductor substrate; forming opposite second dielectric layers along said floating gates and the sidewall of said first dielectric within said opening; depositing a polysilicon layer wherein the excess polysilicon layer is etched back; forming a conformal protection isolation layer over said polysilicon layer; removing the first dielectric layer and the buffer isolation layer outside said floating gate; forming, in order, a third dielectric layer and a control gate layer; and removing part of the control gate layer to form control gates.
 9. The process of claim 8, wherein said part of silicon layer is removed by anisotropic etch.
 10. The process of claim 8, wherein said part of gate isolation layer is removed by wet etch.
 11. The process of claim 8, wherein said floating gates are of opposite sidewall spacer-like structure.
 12. The process of claim 8, wherein said second dielectric layer can be any of an oxide, a combination of oxide and silicon nitride, or a combination of oxide, silicon nitride and oxide. 